Catenaa, Saturday, July 25, 2026 – Samsung Electronics won a contract worth more than $200 billion to make chips for Broadcom, in a race to win a larger share of the AI infrastructure market.
The pact, to run for five years through 2030, will focus on Samsung’s 2-nanometer and below process technologies for Broadcom’s products, the South Korean chipmaker said in a statement on Saturday.
The deal expands the two companies’ strategic collaboration across memory and foundry technology.
Samsung and domestic peer SK Hynix are accelerating their global push for artificial intelligence chip orders amid intensifying competition from rivals such as Taiwan Semiconductor Manufacturing Company.
Korea aims to double its memory production capacity within five years and secure world-class manufacturing capabilities to pull far ahead of competing nations.
On the memory front, Samsung will support Broadcom’s next-generation AI accelerators, the company said.
The collaboration is expected to extend to advanced packaging technologies built on Samsung’s 2nm process, including 2.3D and 2.5D integration, enabling higher-performance, more power-efficient AI and networking silicon.
South Korean President Lee Jae Myung is on a visit to Silicon Valley, where he is attending an AI summit.
Multiple tech deals are being announced as part of his trip, including partnerships between Nvidia and South Korea’s Naver and SK Hynix.
SK Group has signed deals worth $750 billion, including SK Hynix’s partnership with Nvidia valued at more than $500 billion, South Korea’s presidential Blue House said after an AI summit hosted by President Lee Jae Myung in San Francisco.
Speaking at the summit, Lee said South Korea would lead the way to a new era of AI in partnership with global technology companies, making available its “dynamic AI ecosystem” to expand the global market for industrial and personal AI use.
He unveiled a “San Francisco AI Declaration” that outlined South Korea’s AI ambitions for technological cooperation with the United States.
“I’d like to present a vision for the future of AI and propose global cooperation to make it happen,” Lee said.
Lee separately met with Nvidia CEO Jensen Huang, OpenAI CEO Sam Altman, Anthropic CEO Dario Amodei and Broadcom CEO Hock Tan, before joining the summit.
The initiative includes a long-term partnership with SK Hynix to secure next-generation memory supply for Nvidia and jointly develop high-bandwidth memory for AI training, AI agents and physical AI applications.
As part of the agreement, SK Telecom plans to build a 2-gigawatt data center powered by Vera Rubin chips and SK Hynix’s HBM4 high-bandwidth (HBM) memory chips. The data center is due online in 2027.
SK Chairman Chey said AI customers were seeking far more memory than previously anticipated, pointing to recent discussions with Nvidia, Anthropic, OpenAI and Broadcom.
Chey said Nvidia’s projected memory requirement over the next five years could soon prove to be higher.
